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Thermal Aspects of Silicon Photonic Interposer Packages:
, In:
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
,
Oprins, Herman
;
Ban, Yoojin
;
Cherman, Vladimir
. - p. 1-6 , 2020
Link:
https://doi.org/10.1109/EuroSimE48426.2020.9152630
RT T1 <cTitle>2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</cTitle>: T1 <Title>Thermal Aspects of Silicon Photonic Interposer Packages</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9152630&Exemplar=1&LAN=DE A1 Oprins, Herman A1 Ban, Yoojin A1 Cherman, Vladimir A1 Campenhout, Joris Van YR 2020 K1 Silicon K1 Photonics K1 Integrated optics K1 Integrated circuits K1 Thermal analysis K1 Modulation K1 Heating systems SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/EuroSimE48426.2020.9152630 DO https://doi.org/10.1109/EuroSimE48426.2020.9152630 SF ELIB - SuUB Bremen
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