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1 Ergebnisse
1
Solder Crack Improvement For A Power Package During TCT And..:
, In:
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
,
Fan, Haibo
;
Boettcher, Tim
;
Li, Civen
... - p. 1-4 , 2020
Link:
https://doi.org/10.1109/EuroSimE48426.2020.9152707
RT T1 <cTitle>2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</cTitle>: T1 <Title>Solder Crack Improvement For A Power Package During TCT And PTC By Simulation</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9152707&Exemplar=1&LAN=DE A1 Fan, Haibo A1 Boettcher, Tim A1 Li, Civen A1 Cheam, Eric A1 Yang, Jun A1 Chen, Haibin YR 2020 SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/EuroSimE48426.2020.9152707 DO https://doi.org/10.1109/EuroSimE48426.2020.9152707 SF ELIB - SuUB Bremen
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