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1 Ergebnisse
1
Optimization of Thermal Vias Design in PCB-Based Power Circ..:
, In:
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
,
Catalano, A. P.
;
Trani, R.
;
Scognamillo, C.
.. - p. 1-5 , 2020
Link:
https://doi.org/10.1109/EuroSimE48426.2020.9152723
RT T1 <cTitle>2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</cTitle>: T1 <Title>Optimization of Thermal Vias Design in PCB-Based Power Circuits</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9152723&Exemplar=1&LAN=DE A1 Catalano, A. P. A1 Trani, R. A1 Scognamillo, C. A1 d'Alessandro, V. A1 Castellazzi, A. YR 2020 K1 TV K1 Finite element analysis K1 Plating K1 Thermal resistance K1 Cooling K1 Performance evaluation K1 Gallium nitride SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/EuroSimE48426.2020.9152723 DO https://doi.org/10.1109/EuroSimE48426.2020.9152723 SF ELIB - SuUB Bremen
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