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1 Ergebnisse
1
Structure Function Assisted Thermal Coupling Analysis for P..:
, In:
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
,
Pottage, Daniel
;
Li, Xiang
;
Packwood, Matt
.. - p. 1-4 , 2020
Link:
https://doi.org/10.1109/EuroSimE48426.2020.9152725
RT T1 <cTitle>2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</cTitle>: T1 <Title>Structure Function Assisted Thermal Coupling Analysis for Paralleling Power Semiconductor Chips</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9152725&Exemplar=1&LAN=DE A1 Pottage, Daniel A1 Li, Xiang A1 Packwood, Matt A1 Li, Daohui A1 Wang, Yangang YR 2020 K1 Insulated gate bipolar transistors K1 Solid modeling K1 Numerical models K1 Heating systems K1 Coolants K1 Cold plates K1 Impedance SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/EuroSimE48426.2020.9152725 DO https://doi.org/10.1109/EuroSimE48426.2020.9152725 SF ELIB - SuUB Bremen
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