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Residual Stress Characterisation of Thin Sputtered Copper F..:

, In: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Wunderle, B. ; Meszmer, P. ; Mohnot, A.... - p. 1-7 , 2020
Link: https://doi.org/10.1109/EuroSimE48426.2020.9152734