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1 Ergebnisse
1
3-D FEM Investigation on Electrical Ruggedness of Double-Si..:
, In:
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
,
Scognamillo, C.
;
Catalano, A. P.
;
Trani, R.
.. - p. 1-4 , 2020
Link:
https://doi.org/10.1109/EuroSimE48426.2020.9152740
RT T1 <cTitle>2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</cTitle>: T1 <Title>3-D FEM Investigation on Electrical Ruggedness of Double-Sided Cooled Power Modules</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9152740&Exemplar=1&LAN=DE A1 Scognamillo, C. A1 Catalano, A. P. A1 Trani, R. A1 d'Alessandro, V. A1 Castellazzi, A. YR 2020 K1 Finite element analysis K1 Silicon carbide K1 Reliability K1 Multichip modules K1 Substrates K1 Electric fields K1 Insulators SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/EuroSimE48426.2020.9152740 DO https://doi.org/10.1109/EuroSimE48426.2020.9152740 SF ELIB - SuUB Bremen
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