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1
A Reliability Assessment Approach for The Biomimetic Neuron..:
, In:
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
,
Sun, Bo
;
Lei, Ziquan
;
Guo, Chunbing
. - p. 1-4 , 2020
Link:
https://doi.org/10.1109/EuroSimE48426.2020.9152741
RT T1 <cTitle>2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</cTitle>: T1 <Title>A Reliability Assessment Approach for The Biomimetic Neuron Circuit</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9152741&Exemplar=1&LAN=DE A1 Sun, Bo A1 Lei, Ziquan A1 Guo, Chunbing A1 Zhang, Guohao YR 2020 K1 Neurons K1 Capacitors K1 Integrated circuit modeling K1 Degradation K1 Biological system modeling K1 Integrated circuit reliability K1 Hodgkin-Huxley Neuron K1 Capacitor K1 Neuromorphic Circuit K1 Communication SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/EuroSimE48426.2020.9152741 DO https://doi.org/10.1109/EuroSimE48426.2020.9152741 SF ELIB - SuUB Bremen
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