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Determining adhesion of critical interfaces in microelectro..:
, In:
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
,
Reuther, G.M.
;
Albrecht, J.
;
Pufall, R.
.. - p. 1-6 , 2020
Link:
https://doi.org/10.1109/EuroSimE48426.2020.9152755
RT T1 <cTitle>2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</cTitle>: T1 <Title>Determining adhesion of critical interfaces in microelectronics – a reverse Finite Element Modelling approach based on nanoindentation – Part I</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9152755&Exemplar=1&LAN=DE A1 Reuther, G.M. A1 Albrecht, J. A1 Pufall, R. A1 Dudek, R. A1 Rzepka, S. YR 2020 K1 Load modeling K1 Stress K1 Delamination K1 Finite element analysis K1 Silicon K1 Silicon compounds K1 Adhesives SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/EuroSimE48426.2020.9152755 DO https://doi.org/10.1109/EuroSimE48426.2020.9152755 SF ELIB - SuUB Bremen
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