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Mechanical characterization and modeling of different pad s..:
, In:
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
,
Calabretta, Michele
;
Guarnera, Daniele
;
Sitta, Alessandro
... - p. 1-5 , 2020
Link:
https://doi.org/10.1109/EuroSimE48426.2020.9152799
RT T1 <cTitle>2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</cTitle>: T1 <Title>Mechanical characterization and modeling of different pad structures</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9152799&Exemplar=1&LAN=DE A1 Calabretta, Michele A1 Guarnera, Daniele A1 Sitta, Alessandro A1 Renna, Marco A1 Sciuto, Antonella A1 D'Arrigo, Giuseppe A1 Oliveri, Salvatore Massimo A1 Sequenzia, Gaetano YR 2020 K1 Stress K1 Tungsten K1 Dielectrics K1 Manganese K1 Load modeling K1 Layout SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/EuroSimE48426.2020.9152799 DO https://doi.org/10.1109/EuroSimE48426.2020.9152799 SF ELIB - SuUB Bremen
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