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DC Breakdown Behaviour of Liquid-Solid Interfaces Formed in..:
, In:
2020 IEEE Electrical Insulation Conference (EIC)
,
Chmura, Lukasz
;
Santosh, Adeep
;
van Nes, Paul
... - p. 6-9 , 2020
Link:
https://doi.org/10.1109/EIC47619.2020.9158725
RT T1
2020 IEEE Electrical Insulation Conference (EIC)
: T1
DC Breakdown Behaviour of Liquid-Solid Interfaces Formed in Silicone Based Materials
UL https://suche.suub.uni-bremen.de/peid=ieee-9158725&Exemplar=1&LAN=DE A1 Chmura, Lukasz A1 Santosh, Adeep A1 van Nes, Paul A1 Heller, Radek A1 Mor, Armando Rodrigo A1 Niasar, Mohamad Ghaffarian A1 Bergsma, Dennis YR 2020 SN 2576-6791 K1 Liquids K1 Electric breakdown K1 Solids K1 Stress K1 Conductivity K1 Insulation K1 Moisture K1 Interface K1 silicone K1 liquid filled joint K1 DC breakdown K1 tangential field K1 normal field K1 MV DC SP 6 OP 9 LK http://dx.doi.org/https://doi.org/10.1109/EIC47619.2020.9158725 DO https://doi.org/10.1109/EIC47619.2020.9158725 SF ELIB - SuUB Bremen
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