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Challenges of large Fan out multi-chip module and fine Cu l..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Lung Huang, Yu ; Key Chung, C. ; Lin, C. F.... - p. 1140-1145 , 2020
Link: https://doi.org/10.1109/ECTC32862.2020.00183