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1 Ergebnisse
1
A Mechanics Model for the Moisture Induced Delamination in ..:
, In:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
,
Chiu, Tz-Cheng
;
Wu, Ji-Yen
;
Liu, Wei-Te
... - p. 1205-1211 , 2020
Link:
https://doi.org/10.1109/ECTC32862.2020.00193
RT T1 <cTitle>2020 IEEE 70th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>A Mechanics Model for the Moisture Induced Delamination in Fan-Out Wafer-Level Package</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9159182&Exemplar=1&LAN=DE A1 Chiu, Tz-Cheng A1 Wu, Ji-Yen A1 Liu, Wei-Te A1 Liu, Chang-Wei A1 Chen, Dao-Long A1 Shih, MengKai A1 Tarng, David YR 2020 SN 2377-5726 K1 Moisture K1 Absorption K1 Electromagnetic compatibility K1 Numerical models K1 Adhesives K1 Polymers K1 Stress K1 moisture K1 debond K1 fracture mechanics K1 critical strain energy release rate K1 fan-out SP 1205 OP 1211 LK http://dx.doi.org/https://doi.org/10.1109/ECTC32862.2020.00193 DO https://doi.org/10.1109/ECTC32862.2020.00193 SF ELIB - SuUB Bremen
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