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1 Ergebnisse
1
A Mechanistic Study of Underfill Cracks by the Confocal-DIC..:
, In:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
,
Yang, Ying
;
Habib, Fakhreddine
;
Momar Souare, Papa
.. - p. 1087-1093 , 2020
Link:
https://doi.org/10.1109/ECTC32862.2020.00175
RT T1 <cTitle>2020 IEEE 70th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>A Mechanistic Study of Underfill Cracks by the Confocal-DIC Method</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9159189&Exemplar=1&LAN=DE A1 Yang, Ying A1 Habib, Fakhreddine A1 Momar Souare, Papa A1 Duchesne, Eric A1 Sylvestre, Julien YR 2020 SN 2377-5726 K1 Electronic components K1 Conferences K1 underfill K1 confocal microscopy K1 digital image correlation K1 fracture mechanics K1 extended finite element method SP 1087 OP 1093 LK http://dx.doi.org/https://doi.org/10.1109/ECTC32862.2020.00175 DO https://doi.org/10.1109/ECTC32862.2020.00175 SF ELIB - SuUB Bremen
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