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3D Integrated Through Fused Silica Via (TFV) Based Array An..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Bowrothu, Renuka ; Kim, Haein ; Yoon, Yong Kyu. - p. 95-100 , 2020
Link: https://doi.org/10.1109/ECTC32862.2020.00028