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Study on Advanced Substrate for Double-side Package to Redu..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Kim, Ji-Hee ; Yoon, Kwan-Sun ; Oh, Hwa-Dong... - p. 1904-1909 , 2020
Link: https://doi.org/10.1109/ECTC32862.2020.00297