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1 Ergebnisse
1
Defect Localization in Through-Si-Interposer Based 2.5D ICs:
, In:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
,
Bhuvanendran Nair Gourikutty, Sajay
;
Meng Chow, Yew
;
Alton, Jesse
... - p. 1180-1185 , 2020
Link:
https://doi.org/10.1109/ECTC32862.2020.00189
RT T1 <cTitle>2020 IEEE 70th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Defect Localization in Through-Si-Interposer Based 2.5D ICs</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9159199&Exemplar=1&LAN=DE A1 Bhuvanendran Nair Gourikutty, Sajay A1 Meng Chow, Yew A1 Alton, Jesse A1 Bhimrao Umralkar, Ratan A1 Bai, Haonan A1 Keng Chua, Kok A1 Bhattacharya, Surya YR 2020 SN 2377-5726 K1 Circuit faults K1 Pins K1 Integrated circuit modeling K1 Voltage measurement K1 Transmission line measurements K1 RLC circuits K1 Failure analysis K1 Fault localization K1 Advanced packaging K1 3-D x-ray K1 EOTPR K1 Non-destructive analysis K1 2.5D IC K1 3D IC SP 1180 OP 1185 LK http://dx.doi.org/https://doi.org/10.1109/ECTC32862.2020.00189 DO https://doi.org/10.1109/ECTC32862.2020.00189 SF ELIB - SuUB Bremen
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