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1 Ergebnisse
1
Pressureless transient liquid phase sintering bonding using..:
, In:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
,
Hwang, Byeong-Uk
;
Min, Kyung Deuk
;
Jung, Kwang-Ho
... - p. 1855-1860 , 2020
Link:
https://doi.org/10.1109/ECTC32862.2020.00290
RT T1 <cTitle>2020 IEEE 70th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Pressureless transient liquid phase sintering bonding using SAC305 with hybrid Ag particles for high–temperature packaging applications</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9159203&Exemplar=1&LAN=DE A1 Hwang, Byeong-Uk A1 Min, Kyung Deuk A1 Jung, Kwang-Ho A1 Lee, Choong-Jae A1 Kim, Jae-Ha A1 Jung, Seung-Boo YR 2020 SN 2377-5726 K1 Bonding K1 Metals K1 Surface cracks K1 Corrosion K1 Liquids K1 component K1 Transient liquid phase sintering K1 SAC305 K1 Hybrid Ag particle K1 Pressureless bonding K1 High temperature storage test K1 Salt spray test SP 1855 OP 1860 LK http://dx.doi.org/https://doi.org/10.1109/ECTC32862.2020.00290 DO https://doi.org/10.1109/ECTC32862.2020.00290 SF ELIB - SuUB Bremen
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