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1 Ergebnisse
1
Better Thermal, Mechanical and Dielectric Properties of Cur..:
, In:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
,
Karim, Zia
;
Sautter, Kenneth
;
Song, Kay
... - p. 321-326 , 2020
Link:
https://doi.org/10.1109/ECTC32862.2020.00059
RT T1
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
: T1
Better Thermal, Mechanical and Dielectric Properties of Cured Polyimides Using Low Pressure Vacuum Cure Processing
UL https://suche.suub.uni-bremen.de/peid=ieee-9159204&Exemplar=1&LAN=DE A1 Karim, Zia A1 Sautter, Kenneth A1 Song, Kay A1 Galande, Charudatta A1 Lee, Sung Yeon A1 Singh, Kaushal A1 Zussman, Melvin A1 Legario, Ron YR 2020 SN 2377-5726 K1 Films K1 Polyimides K1 Temperature measurement K1 Solvents K1 Dielectrics K1 Temperature K1 Substrates K1 Heterogeneous Integration (HI) K1 FOWLP K1 FOPLP K1 Polyimide K1 Vacuum Cure SP 321 OP 326 LK http://dx.doi.org/https://doi.org/10.1109/ECTC32862.2020.00059 DO https://doi.org/10.1109/ECTC32862.2020.00059 SF ELIB - SuUB Bremen
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