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Imprint-Through Mold Via (i-TMV) with High Aspect Ratio and..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Li, Xinrong ; Ogawa, Tsuyoshi ; Shibata, Tomoaki... - p. 120-125 , 2020
Link: https://doi.org/10.1109/ECTC32862.2020.00032