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1 Ergebnisse
1
Learning the Stress-Strain Relationships of Ultra-Thin Pack..:
, In:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
,
Selvanayagam, Cheryl
;
Trung Duong, Pham Luu
;
Raghavan, Nagarajan
- p. 1638-1645 , 2020
Link:
https://doi.org/10.1109/ECTC32862.2020.00257
RT T1
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
: T1
Learning the Stress-Strain Relationships of Ultra-Thin Package Materials using a Bayesian Approach
UL https://suche.suub.uni-bremen.de/peid=ieee-9159224&Exemplar=1&LAN=DE A1 Selvanayagam, Cheryl A1 Trung Duong, Pham Luu A1 Raghavan, Nagarajan YR 2020 SN 2377-5726 K1 Substrates K1 Material properties K1 Temperature K1 Sensitivity K1 Artificial neural networks K1 Computational modeling K1 Finite element analysis K1 Bayesian Inference K1 Digital Image Correlation K1 Markov Chain Monte Carlo (MCMC) K1 Neural Network K1 Ultra-Thin Package K1 Warpage SP 1638 OP 1645 LK http://dx.doi.org/https://doi.org/10.1109/ECTC32862.2020.00257 DO https://doi.org/10.1109/ECTC32862.2020.00257 SF ELIB - SuUB Bremen
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