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1 Ergebnisse
1
Fine-Pitch RDL Integration for Fan-Out Wafer-Level Packagin:
, In:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
,
Lianto, Prayudi
;
Tan, Chin Wei
;
Jie Peng, Qi
... - p. 1126-1131 , 2020
Link:
https://doi.org/10.1109/ECTC32862.2020.00181
RT T1 <cTitle>2020 IEEE 70th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Fine-Pitch RDL Integration for Fan-Out Wafer-Level Packaging</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9159233&Exemplar=1&LAN=DE A1 Lianto, Prayudi A1 Tan, Chin Wei A1 Jie Peng, Qi A1 Jumat, Abdul Hakim A1 Dai, Xundong A1 Peter Fung, Khai Mum A1 Huei See, Guan A1 Chong, Ser Choong A1 Wee David Ho, Soon A1 Serine Soh, Siew Boon A1 Huang Sharon Lim, Seow A1 Calvin Chua, Hung Ming A1 Abdillah Haron, Ahmad A1 Kenneth Lee, Huan Ching A1 Zhang, Mingsheng A1 Ko, Zhi Hao A1 Ko San, Ye A1 Leong, Henry YR 2020 SN 2377-5726 K1 Semiconductor device reliability K1 Polymers K1 Plating K1 Resistance K1 Electromagnetic compatibility K1 Wafer scale integration K1 FOWLP K1 RDL K1 warpage K1 CMP K1 undercut K1 leakage K1 reliability SP 1126 OP 1131 LK http://dx.doi.org/https://doi.org/10.1109/ECTC32862.2020.00181 DO https://doi.org/10.1109/ECTC32862.2020.00181 SF ELIB - SuUB Bremen
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