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Mechanical Deformation Study of Flexible Leadset Components..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),

Stewart, Benjamin G. ; Cahn, Gabriel ; Samet, David... - p. 532-540 , 2020

Link: https://doi.org/10.1109/ECTC32862.2020.00090

RT 
T1 <cTitle>2020 IEEE 70th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Mechanical Deformation Study of Flexible Leadset Components for Electromechanical Reliability of Wearable Electrocardiogram Sensors</Title>

UL https://suche.suub.uni-bremen.de/peid=ieee-9159238&Exemplar=1&LAN=DE
				
A1 Stewart, Benjamin G.
A1 Cahn, Gabriel
A1 Samet, David
A1 Misner, Matthew J.
A1 Burns, Andrew
A1 Weerawarne, Darshana L.
A1 Poliks, Mark D.
A1 Lapinski, Carol
A1 Dugan, Shannon
A1 Pierron, Olivier
A1 Antoniou, Antonia
A1 Graham, Samuel
A1 Alizadeh, Azar
A1 Sitaraman, Suresh K.
YR 2020
SN 2377-5726
K1 Lead
K1 Strain
K1 Ink
K1 Silver
K1 Numerical models
K1 Analytical models
K1 Load modeling
K1 flexible electronics
K1 reliability
K1 bend
K1 fold
K1 finite-element modeling
K1 ANSYS
K1 TPU
K1 PET
K1 screen-printed silver inks
SP 532
OP 540
LK http://dx.doi.org/https://doi.org/10.1109/ECTC32862.2020.00090
DO https://doi.org/10.1109/ECTC32862.2020.00090
SF ELIB - SuUB Bremen

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