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Heterogenous Bump Metallurgy Through a Sequential Plating B..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
El Amrani, A. ; Paradis, E. ; Danovitch, D.. - p. 702-709 , 2020
Link: https://doi.org/10.1109/ECTC32862.2020.00116