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1 Ergebnisse
1
"Molded-package-last" Process for Fan-out System in Package..:
, In:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
,
Shibata, Tomoaki
;
Ogawa, Tsuyoshi
;
Li, Xinrong
... - p. 1757-1762 , 2020
Link:
https://doi.org/10.1109/ECTC32862.2020.00274
RT T1 <cTitle>2020 IEEE 70th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>"Molded-package-last" Process for Fan-out System in Package (FO-SiP)</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9159241&Exemplar=1&LAN=DE A1 Shibata, Tomoaki A1 Ogawa, Tsuyoshi A1 Li, Xinrong A1 Yoneda, Satoshi A1 Suzuki, Naoya A1 Nonaka, Toshihisa YR 2020 SN 2377-5726 K1 Integrated circuits K1 Glass K1 Bonding K1 Resistors K1 TV K1 Chemicals K1 FO-SiP K1 molded-package K1 RDL K1 5G SP 1757 OP 1762 LK http://dx.doi.org/https://doi.org/10.1109/ECTC32862.2020.00274 DO https://doi.org/10.1109/ECTC32862.2020.00274 SF ELIB - SuUB Bremen
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