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1 Ergebnisse
1
Heterogeneous Integration Using Organic Interposer Technolo..:
, In:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
,
Scott, George J.
;
Bae, JaeHun
;
Yang, KiYeul
... - p. 885-892 , 2020
Link:
https://doi.org/10.1109/ECTC32862.2020.00145
RT T1
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
: T1
Heterogeneous Integration Using Organic Interposer Technology
UL https://suche.suub.uni-bremen.de/peid=ieee-9159245&Exemplar=1&LAN=DE A1 Scott, George J. A1 Bae, JaeHun A1 Yang, KiYeul A1 Ki, WonMyoung A1 Whitchurch, Nathan A1 Kelly, Mike A1 Zwenger, Curtis A1 Jeon, JongHyun A1 Hwang, TaeKyeong YR 2020 SN 2377-5726 K1 Silicon K1 Plastics K1 Glass K1 Through-silicon vias K1 Substrates K1 Copper K1 Heterogeneous integration K1 chip-last K1 RDL-first High-Density Fan-Out (HDFO) K1 SWIFT® SP 885 OP 892 LK http://dx.doi.org/https://doi.org/10.1109/ECTC32862.2020.00145 DO https://doi.org/10.1109/ECTC32862.2020.00145 SF ELIB - SuUB Bremen
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