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1 Ergebnisse
1
EMI Shielding Technology in 5G RF System in Package Module:
, In:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
,
Li, Jay
;
Tsai, Mike
;
Chiu, Ryan
... - p. 931-937 , 2020
Link:
https://doi.org/10.1109/ECTC32862.2020.00152
RT T1
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
: T1
EMI Shielding Technology in 5G RF System in Package Module
UL https://suche.suub.uni-bremen.de/peid=ieee-9159266&Exemplar=1&LAN=DE A1 Li, Jay A1 Tsai, Mike A1 Chiu, Ryan A1 He, Eric A1 Hsieh, Alex A1 Tsai, Ming-fan A1 Chu, Frank A1 Chen, J. Y. A1 Jian, Shunyu A1 Chen, Simon A1 Wang, Yu-Po YR 2020 SN 2377-5726 K1 Coatings K1 Metals K1 Electromagnetic interference K1 Antenna measurements K1 Ferrites K1 Antennas K1 Frequency measurement K1 5G K1 mmWave K1 SiP K1 Antenna in Package (AiP) K1 EMI Shielding Technology SP 931 OP 937 LK http://dx.doi.org/https://doi.org/10.1109/ECTC32862.2020.00152 DO https://doi.org/10.1109/ECTC32862.2020.00152 SF ELIB - SuUB Bremen
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