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1 Ergebnisse
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Laser-assisted bonding (LAB) and de-bonding (LAdB) as an ad..:
, In:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
,
Fettke, Matthias
;
Kubsch, Timo
;
Kolbasow, Andrej
... - p. 1016-1024 , 2020
Link:
https://doi.org/10.1109/ECTC32862.2020.00165
RT T1
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
: T1
Laser-assisted bonding (LAB) and de-bonding (LAdB) as an advanced process solution for selective repair of 3D and multi-die chip packages
UL https://suche.suub.uni-bremen.de/peid=ieee-9159276&Exemplar=1&LAN=DE A1 Fettke, Matthias A1 Kubsch, Timo A1 Kolbasow, Andrej A1 Bejugam, Vinith A1 Frick, Alexander A1 Teutsch, Thorsten YR 2020 SN 2377-5726 K1 Lasers K1 Measurement by laser beam K1 Maintenance engineering K1 Substrates K1 Temperature measurement K1 Three-dimensional displays K1 Stress K1 laser bonding K1 de-bonding K1 chip repair K1 2D/2.5D/3D package K1 SCSP K1 SIP K1 POP K1 multi-die K1 die removal K1 low-stress SP 1016 OP 1024 LK http://dx.doi.org/https://doi.org/10.1109/ECTC32862.2020.00165 DO https://doi.org/10.1109/ECTC32862.2020.00165 SF ELIB - SuUB Bremen
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