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1 Ergebnisse
1
Synthesis of Boron Nitride Coated Silica Filler for Prepari..:
, In:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
,
Li, Jiaxiong
;
Ren, Yanjuan
;
An, Dong
.. - p. 2019-2024 , 2020
Link:
https://doi.org/10.1109/ECTC32862.2020.00314
RT T1 <cTitle>2020 IEEE 70th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Synthesis of Boron Nitride Coated Silica Filler for Preparing Thermally Conductive Epoxy Composites</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9159281&Exemplar=1&LAN=DE A1 Li, Jiaxiong A1 Ren, Yanjuan A1 An, Dong A1 Moon, Kyoung-sik A1 Wong, Ching-ping YR 2020 SN 2377-5726 K1 Thermal conductivity K1 Silicon compounds K1 Conductivity K1 Blood platelets K1 Loading K1 Surface morphology K1 Thermal loading K1 Epoxy composites K1 Encapsulant K1 Boron Nitride K1 Thermal Conductivity SP 2019 OP 2024 LK http://dx.doi.org/https://doi.org/10.1109/ECTC32862.2020.00314 DO https://doi.org/10.1109/ECTC32862.2020.00314 SF ELIB - SuUB Bremen
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