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1 Ergebnisse
1
mmWave AiP Measurement Turnkey Solution in Millimeter-Wave ..:
, In:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
,
Hsieh, Sheng-Chi
;
Chu, Fu-Cheng
;
Ho, Cheng-Yu
.. - p. 114-119 , 2020
Link:
https://doi.org/10.1109/ECTC32862.2020.00031
RT T1 <cTitle>2020 IEEE 70th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>mmWave AiP Measurement Turnkey Solution in Millimeter-Wave Wireless Communication Applications</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9159307&Exemplar=1&LAN=DE A1 Hsieh, Sheng-Chi A1 Chu, Fu-Cheng A1 Ho, Cheng-Yu A1 Chen, Wei-Yang A1 Wang, Chen-Chao YR 2020 SN 2377-5726 K1 Antenna measurements K1 Antenna arrays K1 Substrates K1 Patch antennas K1 Antenna radiation patterns K1 5G mobile communication K1 Array signal processing K1 28 GHz 5G systems K1 flip-chip ball grid array (FCBGA) package K1 flip chip chip scale (FCCSP) package K1 Antenna in package (AiP) SP 114 OP 119 LK http://dx.doi.org/https://doi.org/10.1109/ECTC32862.2020.00031 DO https://doi.org/10.1109/ECTC32862.2020.00031 SF ELIB - SuUB Bremen
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