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Electromigration Failure Study of a Fine-pitch 2μm/2μm L/S ..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Liang, Chien-Lung ; Lin, Yung-Sheng ; Kao, Chin-Li... - p. 361-366 , 2020
Link: https://doi.org/10.1109/ECTC32862.2020.00065