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1 Ergebnisse
1
A novel iso-thermal intermetallic compound insertion bondin..:
, In:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
,
Hou, Lin
;
Derakhshandeh, Jaber
;
Capuz, Giovanni
... - p. 1442-1447 , 2020
Link:
https://doi.org/10.1109/ECTC32862.2020.00228
RT T1 <cTitle>2020 IEEE 70th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>A novel iso-thermal intermetallic compound insertion bonding approach to improve throughput for 3D die to wafer stacking</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9159326&Exemplar=1&LAN=DE A1 Hou, Lin A1 Derakhshandeh, Jaber A1 Capuz, Giovanni A1 Lofrano, Melina A1 Beyne, Eric A1 Miller, Andy A1 Beyer, Gerald A1 De Wolf, Ingrid YR 2020 SN 2377-5726 K1 Bonding K1 Stacking K1 Resistance K1 Curing K1 Throughput K1 Soldering K1 Morphology K1 bonding strategy K1 intermetallic compound K1 3D die to wafer stacking throughput K1 TCB SP 1442 OP 1447 LK http://dx.doi.org/https://doi.org/10.1109/ECTC32862.2020.00228 DO https://doi.org/10.1109/ECTC32862.2020.00228 SF ELIB - SuUB Bremen
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