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1 Ergebnisse
1
The board level reliability performance and process challen..:
, In:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
,
Kuo, Kuei Hsiao
;
Yi Chiang, Chun
;
Chen, Kuang Hsin
... - p. 2118-2123 , 2020
Link:
https://doi.org/10.1109/ECTC32862.2020.00328
RT T1 <cTitle>2020 IEEE 70th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>The board level reliability performance and process challenges of ultra-thin WLP (package height < 250 μm)</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9159327&Exemplar=1&LAN=DE A1 Kuo, Kuei Hsiao A1 Yi Chiang, Chun A1 Chen, Kuang Hsin A1 Lin, Ting-en A1 Chen, Stan A1 Chien, Feng Lung YR 2020 SN 2377-5726 K1 Legged locomotion K1 Silicon K1 Stress K1 Surface cracks K1 Metals K1 Semiconductor device reliability K1 board level reliability K1 component K1 wafer level package K1 re-distribution layer K1 under bump metallurgy K1 Polybenzoxazoles SP 2118 OP 2123 LK http://dx.doi.org/https://doi.org/10.1109/ECTC32862.2020.00328 DO https://doi.org/10.1109/ECTC32862.2020.00328 SF ELIB - SuUB Bremen
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