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1 Ergebnisse
1
Interfacial Crack Initiation and Delamination Propagation i..:
, In:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
,
Fei, Jiu-Bin
;
Xu, Tao
;
Zhou, Jie-Ying
.. - p. 1186-1191 , 2020
Link:
https://doi.org/10.1109/ECTC32862.2020.00190
RT T1 <cTitle>2020 IEEE 70th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Interfacial Crack Initiation and Delamination Propagation in Cu-filled TSV Structure by Incorporating Cohesive Zone Model and Finite Element Method</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9159330&Exemplar=1&LAN=DE A1 Fei, Jiu-Bin A1 Xu, Tao A1 Zhou, Jie-Ying A1 Ke, Chang-Bo A1 Zhang, Xin-Ping YR 2020 SN 2377-5726 K1 Through-silicon vias K1 Stress K1 Delamination K1 Temperature K1 Plastics K1 Silicon K1 Insulation K1 Cu/SiO2 interface K1 cohesive zone model K1 crack initiation K1 delamination propagation K1 silicon dioxide K1 Cu pad SP 1186 OP 1191 LK http://dx.doi.org/https://doi.org/10.1109/ECTC32862.2020.00190 DO https://doi.org/10.1109/ECTC32862.2020.00190 SF ELIB - SuUB Bremen
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