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SoIC for Low-Temperature, Multi-Layer 3D Memory Integration:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Chen, M. F. ; Lin, C. S. ; Liao, E. B.... - p. 855-860 , 2020
Link: https://doi.org/10.1109/ECTC32862.2020.00139