I agree that this site is using cookies. You can find further informations
here
.
X
Login
Merkliste (
0
)
Home
About us
Home About us
Our history
Profile
Press & public relations
Friends
The library in figures
Exhibitions
Projects
Training, internships, careers
Films
Services & Information
Home Services & Information
Lending and interlibrary loans
Returns and renewals
Training and library tours
My Account
Library cards
New to the library?
Download Information
Opening hours
Learning spaces
PC, WLAN, copy, scan and print
Catalogs and collections
Home Catalogs and Collections
Rare books and manuscripts
Digital collections
Subject Areas
Our sites
Home Our sites
Central Library
Law Library (Juridicum)
BB Business and Economics (BB11)
BB Physics and Electrical Engineering
TB Engineering and Social Sciences
TB Economics and Nautical Sciences
TB Music
TB Art & Design
TB Bremerhaven
Contact the library
Home Contact the library
Staff Directory
Open access & publishing
Home Open access & publishing
Reference management: Citavi & RefWorks
Publishing documents
Open Access in Bremen
zur Desktop-Version
Toggle navigation
Merkliste
1 Ergebnisse
1
Fine-Pitch Interconnection and Highly Integrated Assembly P..:
, In:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
,
Hsu, Ian
;
Chen, Chi-Yuan
;
Lin, Stanley
... - p. 867-872 , 2020
Link:
https://doi.org/10.1109/ECTC32862.2020.00142
RT T1 <cTitle>2020 IEEE 70th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Fine-Pitch Interconnection and Highly Integrated Assembly Packaging with FOMIP (Fan-out Mediatek Innovation Package) Technology</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9159341&Exemplar=1&LAN=DE A1 Hsu, Ian A1 Chen, Chi-Yuan A1 Lin, Stanley A1 Yu, Ta-Jen A1 Hsieh, Ming-Che A1 Kang, KeonTaek A1 Yoon, Seung Wook YR 2020 SN 2377-5726 K1 Flip-chip devices K1 Packaging K1 Substrates K1 Silicon K1 Performance evaluation K1 Manufacturing K1 Robustness K1 eWLB K1 FOWLP K1 2.5D K1 TSV-less K1 FOMIP K1 flip chip K1 fine pitch SP 867 OP 872 LK http://dx.doi.org/https://doi.org/10.1109/ECTC32862.2020.00142 DO https://doi.org/10.1109/ECTC32862.2020.00142 SF ELIB - SuUB Bremen
Export
RefWorks (nur Desktop-Version!)
Flow
(Zuerst in
Flow
einloggen, dann importieren)
