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A Comparative Study of 2.5D and Fan-out Chip on Substrate :..:
, In:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
,
Lai, Wei-Hong
;
Yang, Penny
;
Hu, Ian
... - p. 354-360 , 2020
Link:
https://doi.org/10.1109/ECTC32862.2020.00064
RT T1 <cTitle>2020 IEEE 70th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>A Comparative Study of 2.5D and Fan-out Chip on Substrate : Chip First and Chip Last</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9159342&Exemplar=1&LAN=DE A1 Lai, Wei-Hong A1 Yang, Penny A1 Hu, Ian A1 Liao, Tse-Wei A1 Chen, KarenYU A1 Tarng, David A1 Hung, CP YR 2020 SN 2377-5726 K1 Stress K1 Temperature measurement K1 Strain K1 Substrates K1 Copper K1 Integrated circuits K1 Finite element analysis K1 2.5D K1 FOCoS K1 warpage K1 stress K1 ELK K1 solder joint K1 RDL K1 thermal characteristics SP 354 OP 360 LK http://dx.doi.org/https://doi.org/10.1109/ECTC32862.2020.00064 DO https://doi.org/10.1109/ECTC32862.2020.00064 SF ELIB - SuUB Bremen
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