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1 Ergebnisse
1
Processing Glass Substrate for Advanced Packaging using Las..:
, In:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
,
Santos, Rafael
;
Delrue, Jean-Pol
;
Ambrosius, Norbert
.. - p. 1922-1927 , 2020
Link:
https://doi.org/10.1109/ECTC32862.2020.00300
RT T1 <cTitle>2020 IEEE 70th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Processing Glass Substrate for Advanced Packaging using Laser Induced Deep Etching</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9159344&Exemplar=1&LAN=DE A1 Santos, Rafael A1 Delrue, Jean-Pol A1 Ambrosius, Norbert A1 Ostholt, Roman A1 Schmidt, Stephan YR 2020 SN 2377-5726 K1 Glass K1 Cavity resonators K1 Packaging K1 Lasers K1 Electromagnetic compatibility K1 Etching K1 Substrates K1 FOWLP K1 LIDE K1 Die Alignment K1 Die Position Error K1 Glass Embedding K1 Warpage SP 1922 OP 1927 LK http://dx.doi.org/https://doi.org/10.1109/ECTC32862.2020.00300 DO https://doi.org/10.1109/ECTC32862.2020.00300 SF ELIB - SuUB Bremen
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