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1 Ergebnisse
1
Evaluation of package-level EMI shielding using conformally..:
, In:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
,
Joo, Kisu
;
Lee, Kyu Jae
;
Jun Sung, Hyun
... - p. 647-652 , 2020
Link:
https://doi.org/10.1109/ECTC32862.2020.00107
RT T1 <cTitle>2020 IEEE 70th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Evaluation of package-level EMI shielding using conformally coated conductive and magnetic materials in low and high frequency ranges</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9159348&Exemplar=1&LAN=DE A1 Joo, Kisu A1 Lee, Kyu Jae A1 Jun Sung, Hyun A1 Lee, Seung Jae A1 Young Jeong, Se A1 Park, Hyun Ho A1 Kim, Yoon-Hyun YR 2020 SN 2377-5726 K1 Three-dimensional displays K1 Permeability K1 Magnetic shielding K1 Magnetic noise K1 Two dimensional displays K1 Magnetic resonance imaging K1 Soft magnetic materials K1 EMI shielding K1 ink coating K1 near-field SE K1 low frequency H-field source SP 647 OP 652 LK http://dx.doi.org/https://doi.org/10.1109/ECTC32862.2020.00107 DO https://doi.org/10.1109/ECTC32862.2020.00107 SF ELIB - SuUB Bremen
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