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Fan-out Wafer Level Packaging of GaN Components for RF Appl..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Braun, Tanja ; Nguyen, Thanh Duy ; Voges, Steve... - p. 7-13 , 2020
Link: https://doi.org/10.1109/ECTC32862.2020.00014