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Effects of two-step plasma treatment on Cu and SiO2 surface..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Seo, Han Kyeol ; Eunkyung Kim, Sarah ; Kim, Gahui.. - p. 1677-1683 , 2020
Link: https://doi.org/10.1109/ECTC32862.2020.00263