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1 Ergebnisse
1
Effective Thermal Solution via Wafer Level Packaging Materi..:
, In:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
,
Kim, Junghwa
;
Na, Wool-Chul
;
Kim, JungSeob
... - p. 2013-2018 , 2020
Link:
https://doi.org/10.1109/ECTC32862.2020.00313
RT T1 <cTitle>2020 IEEE 70th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Effective Thermal Solution via Wafer Level Packaging Materials</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9159354&Exemplar=1&LAN=DE A1 Kim, Junghwa A1 Na, Wool-Chul A1 Kim, JungSeob A1 Im, Sumi A1 Lee, Dong-Hwan A1 Lim, Sanghak A1 Kim, Sang-Kyun YR 2020 SN 2377-5726 K1 Thermal conductivity K1 Conductivity K1 Compounds K1 Viscosity K1 High-k dielectric materials K1 Loading K1 Electronic packaging thermal management K1 Fan out wafer level package K1 Wafer level package. 2.5D package K1 Epoxy molding compound K1 Liquid molding compound K1 Packaging molding compounds K1 High thermal conductive encapsulant K1 Thermal conductive epoxy molding compounds SP 2013 OP 2018 LK http://dx.doi.org/https://doi.org/10.1109/ECTC32862.2020.00313 DO https://doi.org/10.1109/ECTC32862.2020.00313 SF ELIB - SuUB Bremen
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