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Development of CMOS-Compatible Low Temperature Cu Bonding O..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Park, Haesung ; Park, Manseok ; Seo, Han Kyeol. - p. 1474-1479 , 2020
Link: https://doi.org/10.1109/ECTC32862.2020.00233