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1 Ergebnisse
1
Development of an Extremely High Thermal Conductivity TIM f..:
, In:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
,
Choi, MiKyeong
;
Jung, HyunHye
;
Oh, KwangSeok
... - p. 1332-1337 , 2020
Link:
https://doi.org/10.1109/ECTC32862.2020.00211
RT T1 <cTitle>2020 IEEE 70th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Development of an Extremely High Thermal Conductivity TIM for Large Electronics Packages in the 4th Industrial Revolution Era</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9159368&Exemplar=1&LAN=DE A1 Choi, MiKyeong A1 Jung, HyunHye A1 Oh, KwangSeok A1 Ryu, DongSu A1 Lee, SangHyoun A1 Do, WonChul A1 Kweon, YoungDo A1 Kelly, Mike A1 Park, KyungRok A1 Khim, JinYoung A1 Huemoeller, Ron YR 2020 SN 2377-5726 K1 Metals K1 Thermal conductivity K1 Graphite K1 Conductivity K1 Reliability K1 Electronic packaging thermal management K1 Polymers K1 component K1 Metal sheet TIM K1 Graphite sheet TIM K1 Ag sintered TIM K1 Lid attach process SP 1332 OP 1337 LK http://dx.doi.org/https://doi.org/10.1109/ECTC32862.2020.00211 DO https://doi.org/10.1109/ECTC32862.2020.00211 SF ELIB - SuUB Bremen
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