I agree that this site is using cookies. You can find further informations
here
.
X
Login
Merkliste (
0
)
Home
About us
Home About us
Our history
Profile
Press & public relations
Friends
The library in figures
Exhibitions
Projects
Training, internships, careers
Films
Services & Information
Home Services & Information
Lending and interlibrary loans
Returns and renewals
Training and library tours
My Account
Library cards
New to the library?
Download Information
Opening hours
Learning spaces
PC, WLAN, copy, scan and print
Catalogs and collections
Home Catalogs and Collections
Rare books and manuscripts
Digital collections
Subject Areas
Our sites
Home Our sites
Central Library
Law Library (Juridicum)
BB Business and Economics (BB11)
BB Physics and Electrical Engineering
TB Engineering and Social Sciences
TB Economics and Nautical Sciences
TB Music
TB Art & Design
TB Bremerhaven
Contact the library
Home Contact the library
Staff Directory
Open access & publishing
Home Open access & publishing
Reference management: Citavi & RefWorks
Publishing documents
Open Access in Bremen
zur Desktop-Version
Toggle navigation
Merkliste
1 Ergebnisse
1
Die to Wafer Stacking with Low Temperature Hybrid Bonding:
, In:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
,
Gao, Guilian
;
Workman, Thomas
;
Uzoh, Cyprian
... - p. 589-594 , 2020
Link:
https://doi.org/10.1109/ECTC32862.2020.00098
RT T1 <cTitle>2020 IEEE 70th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Die to Wafer Stacking with Low Temperature Hybrid Bonding</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9159377&Exemplar=1&LAN=DE A1 Gao, Guilian A1 Workman, Thomas A1 Uzoh, Cyprian A1 Bang, K. M. A1 Mirkarimi, Laura A1 Theil, Jeremy A1 Suwito, Dominik A1 Katkar, Rajesh A1 Fountain, Gill A1 Guevara, Gabe A1 Lee, Bongsub YR 2020 SN 2377-5726 K1 Bonding K1 Surface treatment K1 Stacking K1 Surface topography K1 Flip-chip devices K1 Device-to-device communication K1 Process control K1 low temperature Cu to Cu direct bonding K1 direct bond interconnect (DBI) K1 hybrid bonding K1 D2W K1 D2D K1 stacking K1 reliability SP 589 OP 594 LK http://dx.doi.org/https://doi.org/10.1109/ECTC32862.2020.00098 DO https://doi.org/10.1109/ECTC32862.2020.00098 SF ELIB - SuUB Bremen
Export
RefWorks (nur Desktop-Version!)
Flow
(Zuerst in
Flow
einloggen, dann importieren)
