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1 Ergebnisse
1
Die to Wafer Stacking with Low Temperature Hybrid Bonding:
, In:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
,
Gao, Guilian
;
Workman, Thomas
;
Uzoh, Cyprian
... - p. 589-594 , 2020
Link:
https://doi.org/10.1109/ECTC32862.2020.00098
RT T1
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
: T1
Die to Wafer Stacking with Low Temperature Hybrid Bonding
UL https://suche.suub.uni-bremen.de/peid=ieee-9159377&Exemplar=1&LAN=DE A1 Gao, Guilian A1 Workman, Thomas A1 Uzoh, Cyprian A1 Bang, K. M. A1 Mirkarimi, Laura A1 Theil, Jeremy A1 Suwito, Dominik A1 Katkar, Rajesh A1 Fountain, Gill A1 Guevara, Gabe A1 Lee, Bongsub YR 2020 SN 2377-5726 K1 Bonding K1 Surface treatment K1 Stacking K1 Surface topography K1 Flip-chip devices K1 Device-to-device communication K1 Process control K1 low temperature Cu to Cu direct bonding K1 direct bond interconnect (DBI) K1 hybrid bonding K1 D2W K1 D2D K1 stacking K1 reliability SP 589 OP 594 LK http://dx.doi.org/https://doi.org/10.1109/ECTC32862.2020.00098 DO https://doi.org/10.1109/ECTC32862.2020.00098 SF ELIB - SuUB Bremen
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