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1 Ergebnisse
1
Demonstration of Package Level 3D-printed Direct Jet Imping..:
, In:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
,
Wei, T.-W.
;
Oprins, H.
;
Cherman, V.
... - p. 1422-1429 , 2020
Link:
https://doi.org/10.1109/ECTC32862.2020.00225
RT T1
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
: T1
Demonstration of Package Level 3D-printed Direct Jet Impingement Cooling applied to High power, Large Die Applications
UL https://suche.suub.uni-bremen.de/peid=ieee-9159381&Exemplar=1&LAN=DE A1 Wei, T.-W. A1 Oprins, H. A1 Cherman, V. A1 Yang, Z. A1 Rivera, K. A1 Van der Plas, G. A1 Pawlak, B. J. A1 England, L. A1 Beyne, E. A1 Baelmans, M. YR 2020 SN 2377-5726 K1 Temperature measurement K1 Microfluidics K1 Heating systems K1 Three-dimensional displays K1 Temperature sensors K1 Coolants K1 Liquid cooling K1 power electronics K1 jet impingement cooling K1 low cost fabrication K1 high power SP 1422 OP 1429 LK http://dx.doi.org/https://doi.org/10.1109/ECTC32862.2020.00225 DO https://doi.org/10.1109/ECTC32862.2020.00225 SF ELIB - SuUB Bremen
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