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Demonstration of Package Level 3D-printed Direct Jet Imping..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Wei, T.-W. ; Oprins, H. ; Cherman, V.... - p. 1422-1429 , 2020
Link: https://doi.org/10.1109/ECTC32862.2020.00225