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1 Ergebnisse
1
Effect of annealing on the toughness of 40-μm-wide nanotwin..:
, In:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
,
Hsu, Wei-You
;
Li, Yu-Jin
;
Tseng, I-Hsin
... - p. 906-911 , 2020
Link:
https://doi.org/10.1109/ECTC32862.2020.00148
RT T1 <cTitle>2020 IEEE 70th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Effect of annealing on the toughness of 40-μm-wide nanotwinned Cu lines</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9159382&Exemplar=1&LAN=DE A1 Hsu, Wei-You A1 Li, Yu-Jin A1 Tseng, I-Hsin A1 Lin, Benson Tzu-Hung A1 Chang, Chia-Cheng A1 Chen, Chih YR 2020 SN 2377-5726 K1 Annealing K1 Microstructure K1 Electronic components K1 Conferences K1 Surface treatment K1 Mechanical factors K1 Silicon K1 nanotwinned Cu K1 toughness K1 annealing K1 40-μm-wide Cu lines SP 906 OP 911 LK http://dx.doi.org/https://doi.org/10.1109/ECTC32862.2020.00148 DO https://doi.org/10.1109/ECTC32862.2020.00148 SF ELIB - SuUB Bremen
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