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1 Ergebnisse
1
Achieving Selective Cleaning on Semiconductors Packaging Us..:
, In:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
,
Kencana, Sagung Dewi
;
Chuang, Wallace
;
Changraini, Clarissa
... - p. 1298-1303 , 2020
Link:
https://doi.org/10.1109/ECTC32862.2020.00205
RT T1 <cTitle>2020 IEEE 70th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Achieving Selective Cleaning on Semiconductors Packaging Using Atmospheric Pressure Plasma</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9159388&Exemplar=1&LAN=DE A1 Kencana, Sagung Dewi A1 Chuang, Wallace A1 Changraini, Clarissa A1 Schellkes, Eckart A1 Kuo, Yu-Lin A1 Chang, Ken YR 2020 SN 2377-5726 K1 Plasma temperature K1 Surface cleaning K1 Temperature measurement K1 Surface contamination K1 packaging process K1 plasma indicator K1 atmospheric pressure plasma (APP) K1 selective cleaning area K1 scanning time SP 1298 OP 1303 LK http://dx.doi.org/https://doi.org/10.1109/ECTC32862.2020.00205 DO https://doi.org/10.1109/ECTC32862.2020.00205 SF ELIB - SuUB Bremen
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