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1 Ergebnisse
1
Hybrid Fan-out Package for Vertical Heterogeneous Integrati..:
, In:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
,
Chuang, Po-Yao
;
Lin, M.-L.
;
Hung, S.-T.
... - p. 333-338 , 2020
Link:
https://doi.org/10.1109/ECTC32862.2020.00061
RT T1
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
: T1
Hybrid Fan-out Package for Vertical Heterogeneous Integration
UL https://suche.suub.uni-bremen.de/peid=ieee-9159390&Exemplar=1&LAN=DE A1 Chuang, Po-Yao A1 Lin, M.-L. A1 Hung, S.-T. A1 Wu, Y.-W. A1 Wong, D.-C. A1 Yew, M.-C. A1 Hsu, C.-K. A1 Liao, L.-L A1 Lai, P.-Y. A1 Tsai, P.-H. A1 Chen, S.-M. A1 Cheng, S.-K. A1 Jeng, Shin-Puu YR 2020 SN 2377-5726 K1 Reliability K1 Three-dimensional displays K1 Stacking K1 Routing K1 Strain K1 Memory modules K1 Packaging K1 Fan-out package K1 High density interconnect K1 Heterogeneous integration K1 Module on module K1 System in package SP 333 OP 338 LK http://dx.doi.org/https://doi.org/10.1109/ECTC32862.2020.00061 DO https://doi.org/10.1109/ECTC32862.2020.00061 SF ELIB - SuUB Bremen
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