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Hybrid Fan-out Package for Vertical Heterogeneous Integrati..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Chuang, Po-Yao ; Lin, M.-L. ; Hung, S.-T.... - p. 333-338 , 2020
Link: https://doi.org/10.1109/ECTC32862.2020.00061