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Demonstration of a collective hybrid die-to-wafer integrati..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Suhard, Samuel ; Phommahaxay, Alain ; Kennes, Koen... - p. 1315-1321 , 2020
Link: https://doi.org/10.1109/ECTC32862.2020.00208