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A Novel Packaging and System-Integration Platform with Inte..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),

Ndip, Ivan ; Andersson, Kristoffer ; Kosmider, Stefan... - p. 101-107 , 2020

Link: https://doi.org/10.1109/ECTC32862.2020.00029

RT 
T1 <cTitle>2020 IEEE 70th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>A Novel Packaging and System-Integration Platform with Integrated Antennas for Scalable, Low-Cost and High-Performance 5G mmWave Systems</Title>

UL https://suche.suub.uni-bremen.de/peid=ieee-9159398&Exemplar=1&LAN=DE
				
A1 Ndip, Ivan
A1 Andersson, Kristoffer
A1 Kosmider, Stefan
A1 Le, Thi Huyen
A1 Kanitkar, Abhijeet
A1 van Dijk, Marius
A1 Senthil Murugesan, Kavin
A1 Maas, Uwe
A1 Loher, Thomas
A1 Rossi, Marco
A1 Jaeschke, Johannes
A1 Ostmann, Andreas
A1 Aschenbrenner, Rolf
A1 Schneider-Ramelow, Martin
A1 Lang, Klaus-Dieter
YR 2020
SN 2377-5726
K1 5G mobile communication
K1 Antenna accessories
K1 Antenna arrays
K1 Broadband antennas
K1 Packaging
K1 Dielectrics
K1 5G mmWave
K1 PCB embedding
K1 system-integration platform
K1 integrated antenna
K1 antenna-in-package
K1 mobile communication system
K1 new radio
K1 base stations
SP 101
OP 107
LK http://dx.doi.org/https://doi.org/10.1109/ECTC32862.2020.00029
DO https://doi.org/10.1109/ECTC32862.2020.00029
SF ELIB - SuUB Bremen

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